Which method of solder removal is the most commonly used due to its simplicity and cost?

Wicking is a commonly used method of solder removal due to its simplicity and cost-effectiveness. This technique involves using a copper braid (often referred to as solder wick) that absorbs the solder through capillary action when heat is applied. When a soldering iron is placed on top of the copper braid along with the solder joint, the solder melts and is drawn into the braid, effectively removing it from the circuit board.

This method is favored because it requires minimal equipment; essentially, all that is needed is the solder wick and a soldering iron. It also produces less mess compared to other techniques, making it easier to clean up afterward. The wicking method is particularly useful in smaller applications or where precision is required, as it allows for a controlled removal of solder rather than large scoops that might disturb other components.

In addition, wicking is quick to set up and can be employed with various kinds of solder, further enhancing its utility in various situations. Other methods, while they have their uses, often require additional equipment or have more complex procedures that might not be conducive to every soldering scenario.